Graphene and Carbon Nanotubes for Electronics Nanopackaging

In recent years, the aggressive downscaling of electronic components has led to highly dense and power-hungry devices. With Moores law expected soon reach its physical limit, there is a pressing need significantly improve efficiency performance not only nanodevices, but also embedding environment in which such nanodevices are integrated. this context, key for improving reducing both system cost size electronics packaging. However, packaging at nanoscale (i.e., nanopackaging) currently facing several technological challenges, as scale conventional materials present intrinsic limitations. To address this, it becomes necessary replace these latter with novel alternatives, low-dimensional carbon-based nanomaterials. Carbon nanotubes (CNTs) graphene (materials 1D 2D dimensionality, respectively) have potential be successfully integrated into traditional silicon-based well beyond-silicon electronics, their unique electrical, thermal, mechanical, optical properties could enablers significant improvements. short review we describe why nanomaterials very promising nanopackaging, outline application areas, mainly interconnects, thermal management, flexible